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KMID : 0381920150450020089
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Korean Journal of Microscopy
2015 Volume.45 No. 2 p.89 ~ p.94
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Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy
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Bae Jee-Hwan
Keesam Shin
Lee Joon-Hwan
Kim Mi-Yang
Cheol-Woong Yang
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Abstract
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This article briefly reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.
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KEYWORD
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Step soldering, Melting temperature, Spatial resolution, Scanning electron microscopy, Transmission electron microscopy
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